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Mobile millimeter and centimeter scale robots often use smart composite manufacturing (SCM) for the construction of body components and mechanisms. The fabrication of SCM mechanisms requires laser machining and laminating flexible, adhesive, and structural materials into small-scale hinges, transmissions, and, ultimately, wings or legs. However, a fundamental limitation of SCM components is the plastic deformation and failure of flexures. In this work, we demonstrate that encasing SCM components in a soft silicone mold dramatically improves the durability of SCM flexure hinges and provides robustness to SCM components. We demonstrate this advance in the design of a flapping-wing robot that uses an underactuated compliant transmission fabricated with an inner SCM skeleton and exterior silicone mold. The transmission design is optimized to achieve desired wingstroke requirements and to allow for independent motion of each wing. We validate these design choices in bench-top tests, measuring transmission compliance, kinematics, and fatigue. We integrate the transmission with laminate wings and two types of actuation, demonstrating elastic energy exchange and limited lift-off capabilities. Lastly, we tested collision mitigation through flapping-wing experiments that obstructed the motion of a wing. These experiments demonstrate that an underactuated compliant transmission can provide resilience and robustness to flapping-wing robots.more » « less
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Gao, Hang; Bhat, Ganapati; Ogras, Umit Y.; Ozev, Sule (, 2019 IEEE 37th VLSI Test Symposium (VTS))Flexible hybrid electronics (FHE) is emerging as a promising solution to combine the benefits of printed electronics and silicon technology. FHE has many high-impact potential areas, such as wearable applications, health monitoring, and soft robotics, due to its physical advantages, which include light weight, low cost and the ability conform to different shapes. However, physical deformations in the field can lead to significant testing and validation challenges. For example, designers must ensure that FHE devices continue to meet their specs even when the components experience stress due to bending. Hence, physical deformation, which is hard to emulate, has to be part of the test procedures for FHE devices. This paper is the first to analyze stress experience at different parts of FHE devices under different bending conditions. We develop a novel methodology to maximize the test coverage with minimum number of text vectors with the help of a mixed integer linear programming formulation. We validate the proposed approach using an FHE prototype and COMSOL Multiphysics simulations.more » « less
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